Patent
US 9,633,899photoresist
water-soluble graphene material
metal base
copper
Cu
nickel
Ni
copper-nickel alloy
Cu-Ni
inorganic silicon compound material
silicon nitride
Si₃N₄
hydrofluoric acid
HF
metal material (isolation layer)
polymethyl methacrylate (PMMA)
photoresist
water-soluble graphene material
metal base
copper
Cu
nickel
Ni
copper-nickel alloy
Cu-Ni
inorganic silicon compound material
silicon nitride
Si₃N₄
hydrofluoric acid
HF
metal material (isolation layer)
polymethyl methacrylate (PMMA)
photoresist
water-soluble graphene material
metal base
copper
Cu
nickel
Ni
copper-nickel alloy
Cu-Ni
inorganic silicon compound material
silicon nitride
Si₃N₄
hydrofluoric acid
HF
metal material (isolation layer)
polymethyl methacrylate (PMMA)
photoresist
water-soluble graphene material
metal base
copper
Cu
nickel
Ni
copper-nickel alloy
Cu-Ni
inorganic silicon compound material
silicon nitride
Si₃N₄
hydrofluoric acid
HF
metal material (isolation layer)
polymethyl methacrylate (PMMA)