Patent
US 9,029,833Patent
Atlas literature
Patent
US 9,029,833Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
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T-appat f m- tctor a aratus co n rlsm a emiconductor struture with a f irst sur fac e; a yTa phon e l iv er dis o sed over at jeant aL)Cro on -, f t h~e f~ irst s u rfa ce oft the sem-ic ondui ctor st ruc ture and hav inz an ii er s u~ rfac e: wh ith a first o nt ion c onnz ured to collec~t.r { ho rc-enera ie rrs -er-a ed wu hi n Tte semiconductor s tui re aing t o es tab] i.1a potential on t first surface oft semiconductor structure:s a fir st contact struc tu re e ldcricali co~nnectedi to the; semicondi uctor st ru c tur e an di a scond -conia ct st rciure electrically co jij ecte d ti ac sec ondi port on~ of th 1 uppe surface of h rahne Iat 'e wherein the first and second contact structures are Thined on ath and Page 2 of 11 U.S. Application No. 14/471,001 Response to Office Action dated wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
appamsfca 4 detector aaratus conrising: a semiconductor structure with a first surface; a japh~l ene layer disp ose d over at lea st a p~ on oi f the firsT suj- fac e, of the s wmiconductor structure and hang a isac th a first fordon configured o coll-ct ? hoto e~ne rate dl carriers ae nerated w ithin the: se m~ icond ui ctor str uctu re and to establish a poentiai 'n the first S urface of the semiconductor structure: a first contact st ru. cture elec tr ical ly connected to the se mniccn ductor structure: and a second contact struct ulre electrica lly conn e ted to a seco n d o rtion of th e; u 2 er surt ace of Tbe rphn ivi wA herein thi e first and second contact structures are for med on a to side o f the a aratus ' anid wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
A detector a 3 aratus.
The apparatus of claim 8, comprising a semiconductor epitaxial nucleation layer formed on a top side of the support substrate, wherein the semiconductor structure comprises an epitaxially grown semiconductor material formed over the nucleation layer.
ppaats-e4 ± detector aparaf--s, conrisin a semiconductor structure with a first surface a graptene -ia_'er disjj posed over a t, least a,o zriion ofl th~e firs t sul rface o f The h otognereatd cariers enerated wth in t he s e iconductor structure and to establish a o3tentitd on the f irst surface of t h e s emsico3 nduct o3r str uct ure:; a first contact structure electrically conn e cted to the se~mi conductor str ui ctur e:; and a second. contact st ru ctur e eletricaly conn e ted t o a s co nd por t ion of the upp er surface ofp nhr~ pet lay er: wherein the semiconductor structure has a bandgap more than 2.5 electron volts.
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Te-p us-dim4-A deveaor appara ts.compri s: Page 5 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a s e~ miconductor str ii ctur e. with a first surface; a raee Ia "cer lis ose pee d over at least a 2 orti o~ n of t h~e first surface of the se imcn duci r s uucture and hang ppe surface with a f irst ri. confi u ed to co lect photo 2enera ed carriers gee rat edc within the semiconductor structure and to establish a first contact structure sectrical I connected to the semiconductor strutre: and a second c on tact struc t ure electrical lv connected t o a sec on d)ortio i of the a 3er surface of the gra ~ hene lay ery wherein the second contact structure and the first contact structure have about the same voltage.
Th- apparata fdaim4-Ad ar s c 3 a semiconducvor stnuctre with a first sur fac e; aL yra heu ne ia' er dl is osed over at lea st a 3 rti o n of the first s u rface of the seL miconductor st i-t cture and havi nQ an upp er su rt ace wubt a first por ti on ~o niuredl to Coll ect Pt r cigenr i£edcanitrs ge ner atedi whi n Tfte semi con ductor. str ucture anird t o es tab] i sh a potential on the first surface of the sewiconductor structure: a fi rst contact struc ture electicali co nectec to the; sem iconductor st rcc tur e and.
A detector apparatus, comprising: an epitaxial semiconductor structure with a first surface; Page 6 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a graphene layer disposed directly on at least a portion of the first surface of the semiconductor structure to form a heterojunction with the semiconductor structure, an upper surface of the graphene layer having a first portion thereof configured to establish a potential on the first surface of the semiconductor structure and to collect photogenerated carriers from the semiconductor structure; a first contact structure electrically connected to the semiconductor structure; and a second contact structure electrically connected to a second portion of the upper surface of the graphene layer.
The apparatus of claim 14, wherein the first and second contact structures are formed on a top side of the apparatus.
The apparatus of claim 14, wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
The apparatus of claim 14, wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
The apparatus of claim 14, comprising: a plurality of detector cells spaced from one another on the top side of the apparatus, with individual detector cells including: Page 7 of 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene-on-semiconductor UV/EUV photodetector with ohmic contact
graphene-on-semiconductor UV/EUV photodetector with Schottky contact
Materials described outside the worked examples.
graphene
C
semiconductor structure
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
semiconductor bandgap > 2.5 eV (claimed minimum) | ≥ 2.5 eV | semiconductor structure |
graphene layer thickness upper bound | ≤ 3 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,029,833Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
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. canceled
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T-appat f m- tctor a aratus co n rlsm a emiconductor struture with a f irst sur fac e; a yTa phon e l iv er dis o sed over at jeant aL)Cro on -, f t h~e f~ irst s u rfa ce oft the sem-ic ondui ctor st ruc ture and hav inz an ii er s u~ rfac e: wh ith a first o nt ion c onnz ured to collec~t.r { ho rc-enera ie rrs -er-a ed wu hi n Tte semiconductor s tui re aing t o es tab] i.1a potential on t first surface oft semiconductor structure:s a fir st contact struc tu re e ldcricali co~nnectedi to the; semicondi uctor st ru c tur e an di a scond -conia ct st rciure electrically co jij ecte d ti ac sec ondi port on~ of th 1 uppe surface of h rahne Iat 'e wherein the first and second contact structures are Thined on ath and Page 2 of 11 U.S. Application No. 14/471,001 Response to Office Action dated wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
appamsfca 4 detector aaratus conrising: a semiconductor structure with a first surface; a japh~l ene layer disp ose d over at lea st a p~ on oi f the firsT suj- fac e, of the s wmiconductor structure and hang a isac th a first fordon configured o coll-ct ? hoto e~ne rate dl carriers ae nerated w ithin the: se m~ icond ui ctor str uctu re and to establish a poentiai 'n the first S urface of the semiconductor structure: a first contact st ru. cture elec tr ical ly connected to the se mniccn ductor structure: and a second contact struct ulre electrica lly conn e ted to a seco n d o rtion of th e; u 2 er surt ace of Tbe rphn ivi wA herein thi e first and second contact structures are for med on a to side o f the a aratus ' anid wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
A detector a 3 aratus.
The apparatus of claim 8, comprising a semiconductor epitaxial nucleation layer formed on a top side of the support substrate, wherein the semiconductor structure comprises an epitaxially grown semiconductor material formed over the nucleation layer.
ppaats-e4 ± detector aparaf--s, conrisin a semiconductor structure with a first surface a graptene -ia_'er disjj posed over a t, least a,o zriion ofl th~e firs t sul rface o f The h otognereatd cariers enerated wth in t he s e iconductor structure and to establish a o3tentitd on the f irst surface of t h e s emsico3 nduct o3r str uct ure:; a first contact structure electrically conn e cted to the se~mi conductor str ui ctur e:; and a second. contact st ru ctur e eletricaly conn e ted t o a s co nd por t ion of the upp er surface ofp nhr~ pet lay er: wherein the semiconductor structure has a bandgap more than 2.5 electron volts.
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Te-p us-dim4-A deveaor appara ts.compri s: Page 5 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a s e~ miconductor str ii ctur e. with a first surface; a raee Ia "cer lis ose pee d over at least a 2 orti o~ n of t h~e first surface of the se imcn duci r s uucture and hang ppe surface with a f irst ri. confi u ed to co lect photo 2enera ed carriers gee rat edc within the semiconductor structure and to establish a first contact structure sectrical I connected to the semiconductor strutre: and a second c on tact struc t ure electrical lv connected t o a sec on d)ortio i of the a 3er surface of the gra ~ hene lay ery wherein the second contact structure and the first contact structure have about the same voltage.
Th- apparata fdaim4-Ad ar s c 3 a semiconducvor stnuctre with a first sur fac e; aL yra heu ne ia' er dl is osed over at lea st a 3 rti o n of the first s u rface of the seL miconductor st i-t cture and havi nQ an upp er su rt ace wubt a first por ti on ~o niuredl to Coll ect Pt r cigenr i£edcanitrs ge ner atedi whi n Tfte semi con ductor. str ucture anird t o es tab] i sh a potential on the first surface of the sewiconductor structure: a fi rst contact struc ture electicali co nectec to the; sem iconductor st rcc tur e and.
A detector apparatus, comprising: an epitaxial semiconductor structure with a first surface; Page 6 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a graphene layer disposed directly on at least a portion of the first surface of the semiconductor structure to form a heterojunction with the semiconductor structure, an upper surface of the graphene layer having a first portion thereof configured to establish a potential on the first surface of the semiconductor structure and to collect photogenerated carriers from the semiconductor structure; a first contact structure electrically connected to the semiconductor structure; and a second contact structure electrically connected to a second portion of the upper surface of the graphene layer.
The apparatus of claim 14, wherein the first and second contact structures are formed on a top side of the apparatus.
The apparatus of claim 14, wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
The apparatus of claim 14, wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
The apparatus of claim 14, comprising: a plurality of detector cells spaced from one another on the top side of the apparatus, with individual detector cells including: Page 7 of 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene-on-semiconductor UV/EUV photodetector with ohmic contact
graphene-on-semiconductor UV/EUV photodetector with Schottky contact
Materials described outside the worked examples.
graphene
C
semiconductor structure
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
semiconductor bandgap > 2.5 eV (claimed minimum) | ≥ 2.5 eV | semiconductor structure |
graphene layer thickness upper bound | ≤ 3 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,029,833Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
. canceled
. canceled
. canceled
. canceled
T-appat f m- tctor a aratus co n rlsm a emiconductor struture with a f irst sur fac e; a yTa phon e l iv er dis o sed over at jeant aL)Cro on -, f t h~e f~ irst s u rfa ce oft the sem-ic ondui ctor st ruc ture and hav inz an ii er s u~ rfac e: wh ith a first o nt ion c onnz ured to collec~t.r { ho rc-enera ie rrs -er-a ed wu hi n Tte semiconductor s tui re aing t o es tab] i.1a potential on t first surface oft semiconductor structure:s a fir st contact struc tu re e ldcricali co~nnectedi to the; semicondi uctor st ru c tur e an di a scond -conia ct st rciure electrically co jij ecte d ti ac sec ondi port on~ of th 1 uppe surface of h rahne Iat 'e wherein the first and second contact structures are Thined on ath and Page 2 of 11 U.S. Application No. 14/471,001 Response to Office Action dated wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
appamsfca 4 detector aaratus conrising: a semiconductor structure with a first surface; a japh~l ene layer disp ose d over at lea st a p~ on oi f the firsT suj- fac e, of the s wmiconductor structure and hang a isac th a first fordon configured o coll-ct ? hoto e~ne rate dl carriers ae nerated w ithin the: se m~ icond ui ctor str uctu re and to establish a poentiai 'n the first S urface of the semiconductor structure: a first contact st ru. cture elec tr ical ly connected to the se mniccn ductor structure: and a second contact struct ulre electrica lly conn e ted to a seco n d o rtion of th e; u 2 er surt ace of Tbe rphn ivi wA herein thi e first and second contact structures are for med on a to side o f the a aratus ' anid wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
A detector a 3 aratus.
The apparatus of claim 8, comprising a semiconductor epitaxial nucleation layer formed on a top side of the support substrate, wherein the semiconductor structure comprises an epitaxially grown semiconductor material formed over the nucleation layer.
ppaats-e4 ± detector aparaf--s, conrisin a semiconductor structure with a first surface a graptene -ia_'er disjj posed over a t, least a,o zriion ofl th~e firs t sul rface o f The h otognereatd cariers enerated wth in t he s e iconductor structure and to establish a o3tentitd on the f irst surface of t h e s emsico3 nduct o3r str uct ure:; a first contact structure electrically conn e cted to the se~mi conductor str ui ctur e:; and a second. contact st ru ctur e eletricaly conn e ted t o a s co nd por t ion of the upp er surface ofp nhr~ pet lay er: wherein the semiconductor structure has a bandgap more than 2.5 electron volts.
. canceled
Te-p us-dim4-A deveaor appara ts.compri s: Page 5 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a s e~ miconductor str ii ctur e. with a first surface; a raee Ia "cer lis ose pee d over at least a 2 orti o~ n of t h~e first surface of the se imcn duci r s uucture and hang ppe surface with a f irst ri. confi u ed to co lect photo 2enera ed carriers gee rat edc within the semiconductor structure and to establish a first contact structure sectrical I connected to the semiconductor strutre: and a second c on tact struc t ure electrical lv connected t o a sec on d)ortio i of the a 3er surface of the gra ~ hene lay ery wherein the second contact structure and the first contact structure have about the same voltage.
Th- apparata fdaim4-Ad ar s c 3 a semiconducvor stnuctre with a first sur fac e; aL yra heu ne ia' er dl is osed over at lea st a 3 rti o n of the first s u rface of the seL miconductor st i-t cture and havi nQ an upp er su rt ace wubt a first por ti on ~o niuredl to Coll ect Pt r cigenr i£edcanitrs ge ner atedi whi n Tfte semi con ductor. str ucture anird t o es tab] i sh a potential on the first surface of the sewiconductor structure: a fi rst contact struc ture electicali co nectec to the; sem iconductor st rcc tur e and.
A detector apparatus, comprising: an epitaxial semiconductor structure with a first surface; Page 6 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a graphene layer disposed directly on at least a portion of the first surface of the semiconductor structure to form a heterojunction with the semiconductor structure, an upper surface of the graphene layer having a first portion thereof configured to establish a potential on the first surface of the semiconductor structure and to collect photogenerated carriers from the semiconductor structure; a first contact structure electrically connected to the semiconductor structure; and a second contact structure electrically connected to a second portion of the upper surface of the graphene layer.
The apparatus of claim 14, wherein the first and second contact structures are formed on a top side of the apparatus.
The apparatus of claim 14, wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
The apparatus of claim 14, wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
The apparatus of claim 14, comprising: a plurality of detector cells spaced from one another on the top side of the apparatus, with individual detector cells including: Page 7 of 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene-on-semiconductor UV/EUV photodetector with ohmic contact
graphene-on-semiconductor UV/EUV photodetector with Schottky contact
Materials described outside the worked examples.
graphene
C
semiconductor structure
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
semiconductor bandgap > 2.5 eV (claimed minimum) | ≥ 2.5 eV | semiconductor structure |
graphene layer thickness upper bound | ≤ 3 nm |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,029,833Patent drawings and their descriptions. Click a drawing to enlarge it.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
. canceled
. canceled
. canceled
. canceled
T-appat f m- tctor a aratus co n rlsm a emiconductor struture with a f irst sur fac e; a yTa phon e l iv er dis o sed over at jeant aL)Cro on -, f t h~e f~ irst s u rfa ce oft the sem-ic ondui ctor st ruc ture and hav inz an ii er s u~ rfac e: wh ith a first o nt ion c onnz ured to collec~t.r { ho rc-enera ie rrs -er-a ed wu hi n Tte semiconductor s tui re aing t o es tab] i.1a potential on t first surface oft semiconductor structure:s a fir st contact struc tu re e ldcricali co~nnectedi to the; semicondi uctor st ru c tur e an di a scond -conia ct st rciure electrically co jij ecte d ti ac sec ondi port on~ of th 1 uppe surface of h rahne Iat 'e wherein the first and second contact structures are Thined on ath and Page 2 of 11 U.S. Application No. 14/471,001 Response to Office Action dated wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
appamsfca 4 detector aaratus conrising: a semiconductor structure with a first surface; a japh~l ene layer disp ose d over at lea st a p~ on oi f the firsT suj- fac e, of the s wmiconductor structure and hang a isac th a first fordon configured o coll-ct ? hoto e~ne rate dl carriers ae nerated w ithin the: se m~ icond ui ctor str uctu re and to establish a poentiai 'n the first S urface of the semiconductor structure: a first contact st ru. cture elec tr ical ly connected to the se mniccn ductor structure: and a second contact struct ulre electrica lly conn e ted to a seco n d o rtion of th e; u 2 er surt ace of Tbe rphn ivi wA herein thi e first and second contact structures are for med on a to side o f the a aratus ' anid wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
A detector a 3 aratus.
The apparatus of claim 8, comprising a semiconductor epitaxial nucleation layer formed on a top side of the support substrate, wherein the semiconductor structure comprises an epitaxially grown semiconductor material formed over the nucleation layer.
ppaats-e4 ± detector aparaf--s, conrisin a semiconductor structure with a first surface a graptene -ia_'er disjj posed over a t, least a,o zriion ofl th~e firs t sul rface o f The h otognereatd cariers enerated wth in t he s e iconductor structure and to establish a o3tentitd on the f irst surface of t h e s emsico3 nduct o3r str uct ure:; a first contact structure electrically conn e cted to the se~mi conductor str ui ctur e:; and a second. contact st ru ctur e eletricaly conn e ted t o a s co nd por t ion of the upp er surface ofp nhr~ pet lay er: wherein the semiconductor structure has a bandgap more than 2.5 electron volts.
. canceled
Te-p us-dim4-A deveaor appara ts.compri s: Page 5 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a s e~ miconductor str ii ctur e. with a first surface; a raee Ia "cer lis ose pee d over at least a 2 orti o~ n of t h~e first surface of the se imcn duci r s uucture and hang ppe surface with a f irst ri. confi u ed to co lect photo 2enera ed carriers gee rat edc within the semiconductor structure and to establish a first contact structure sectrical I connected to the semiconductor strutre: and a second c on tact struc t ure electrical lv connected t o a sec on d)ortio i of the a 3er surface of the gra ~ hene lay ery wherein the second contact structure and the first contact structure have about the same voltage.
Th- apparata fdaim4-Ad ar s c 3 a semiconducvor stnuctre with a first sur fac e; aL yra heu ne ia' er dl is osed over at lea st a 3 rti o n of the first s u rface of the seL miconductor st i-t cture and havi nQ an upp er su rt ace wubt a first por ti on ~o niuredl to Coll ect Pt r cigenr i£edcanitrs ge ner atedi whi n Tfte semi con ductor. str ucture anird t o es tab] i sh a potential on the first surface of the sewiconductor structure: a fi rst contact struc ture electicali co nectec to the; sem iconductor st rcc tur e and.
A detector apparatus, comprising: an epitaxial semiconductor structure with a first surface; Page 6 of 11 U.S. Application No. 14/471,001 Response to Office Action dated a graphene layer disposed directly on at least a portion of the first surface of the semiconductor structure to form a heterojunction with the semiconductor structure, an upper surface of the graphene layer having a first portion thereof configured to establish a potential on the first surface of the semiconductor structure and to collect photogenerated carriers from the semiconductor structure; a first contact structure electrically connected to the semiconductor structure; and a second contact structure electrically connected to a second portion of the upper surface of the graphene layer.
The apparatus of claim 14, wherein the first and second contact structures are formed on a top side of the apparatus.
The apparatus of claim 14, wherein the semiconductor structure is of a first conductivity type and comprises an implanted or epitaxially grown region having a dopant concentration of the first conductivity type greater than a dopant concentration of the remainder of the semiconductor structure, wherein the first contact structure is an ohmic metal contact formed over at least a portion of an upper surface of the implanted or epitaxially grown region of the semiconductor structure.
The apparatus of claim 14, wherein the first contact structure is a Schottky metal contact formed over a portion of the first surface of the semiconductor structure, wherein the first contact structure is laterally spaced from the graphene layer.
The apparatus of claim 14, comprising: a plurality of detector cells spaced from one another on the top side of the apparatus, with individual detector cells including: Page 7 of 11
Layer stacks claimed or described, ordered top of device to substrate.
graphene-on-semiconductor UV/EUV photodetector with ohmic contact
graphene-on-semiconductor UV/EUV photodetector with Schottky contact
Materials described outside the worked examples.
graphene
C
semiconductor structure
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
semiconductor bandgap > 2.5 eV (claimed minimum) | ≥ 2.5 eV | semiconductor structure |
graphene layer thickness upper bound | ≤ 3 nm |
Related documents with shared materials, methods, properties, or citations.
silicon
Si
silicon carbide
SiC
gallium nitride
GaN
aluminum gallium nitride
AlGaN
indium aluminum nitride
InAlN
aluminum nitride
AlN
gallium arsenide
GaAs
indium phosphide
InP
gallium phosphide
GaP
zinc oxide
ZnO
boron nitride
BN
magnesium zinc oxide
graphene layer thickness lower bound | ≥ 0.3 nm | C |
Temperature | 1700–1800 °C | — |
Thickness | 400-100 nm | — |
— | 3.1–12.4 eV | — |
— | 3.1–3.94 eV | — |
— | 3.94–4.43 eV | — |
— | 4.43–12.4 eV | — |
Thickness | 10–300 nm | — |
— | 3.1–4.13 eV | — |
— | 4.13–6.2 eV | — |
— | 6.2–10.16 eV | — |
— | 10.16–10.25 eV | — |
— | 10.25–124 eV | — |
— | 6.2–124 eV | — |
Thickness | ≤ 10 nm | — |
silicon
Si
silicon carbide
SiC
gallium nitride
GaN
aluminum gallium nitride
AlGaN
indium aluminum nitride
InAlN
aluminum nitride
AlN
gallium arsenide
GaAs
indium phosphide
InP
gallium phosphide
GaP
zinc oxide
ZnO
boron nitride
BN
magnesium zinc oxide
graphene layer thickness lower bound | ≥ 0.3 nm | C |
Temperature | 1700–1800 °C | — |
Thickness | 400-100 nm | — |
— | 3.1–12.4 eV | — |
— | 3.1–3.94 eV | — |
— | 3.94–4.43 eV | — |
— | 4.43–12.4 eV | — |
Thickness | 10–300 nm | — |
— | 3.1–4.13 eV | — |
— | 4.13–6.2 eV | — |
— | 6.2–10.16 eV | — |
— | 10.16–10.25 eV | — |
— | 10.25–124 eV | — |
— | 6.2–124 eV | — |
Thickness | ≤ 10 nm | — |
silicon
Si
silicon carbide
SiC
gallium nitride
GaN
aluminum gallium nitride
AlGaN
indium aluminum nitride
InAlN
aluminum nitride
AlN
gallium arsenide
GaAs
indium phosphide
InP
gallium phosphide
GaP
zinc oxide
ZnO
boron nitride
BN
magnesium zinc oxide
graphene layer thickness lower bound | ≥ 0.3 nm | C |
Temperature | 1700–1800 °C | — |
Thickness | 400-100 nm | — |
— | 3.1–12.4 eV | — |
— | 3.1–3.94 eV | — |
— | 3.94–4.43 eV | — |
— | 4.43–12.4 eV | — |
Thickness | 10–300 nm | — |
— | 3.1–4.13 eV | — |
— | 4.13–6.2 eV | — |
— | 6.2–10.16 eV | — |
— | 10.16–10.25 eV | — |
— | 10.25–124 eV | — |
— | 6.2–124 eV | — |
Thickness | ≤ 10 nm | — |
silicon
Si
silicon carbide
SiC
gallium nitride
GaN
aluminum gallium nitride
AlGaN
indium aluminum nitride
InAlN
aluminum nitride
AlN
gallium arsenide
GaAs
indium phosphide
InP
gallium phosphide
GaP
zinc oxide
ZnO
boron nitride
BN
magnesium zinc oxide
graphene layer thickness lower bound | ≥ 0.3 nm | C |
Temperature | 1700–1800 °C | — |
Thickness | 400-100 nm | — |
— | 3.1–12.4 eV | — |
— | 3.1–3.94 eV | — |
— | 3.94–4.43 eV | — |
— | 4.43–12.4 eV | — |
Thickness | 10–300 nm | — |
— | 3.1–4.13 eV | — |
— | 4.13–6.2 eV | — |
— | 6.2–10.16 eV | — |
— | 10.16–10.25 eV | — |
— | 10.25–124 eV | — |
— | 6.2–124 eV | — |
Thickness | ≤ 10 nm | — |
