Patent
US 11,661,346 B2transient electronic device/flexible circuitry/RFID tag/electrode
nickel
Ni
lead
Pb
copper
Cu
aluminum
Al
zinc
Zn
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 4A. SEM images of reduced side of FGG film developed on Zn substrates.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 12D. Cross-sectional SEM images of FGG films 5 reduced on Ni.
FIG. 14. Table showing the fitted results of Cls XPS spectra of reduced and non-reduced side of FGG films 25 reduced on various active metal substrates.
FIG. 15. Table showing the chemical compositions of reduced and non-reduced side of FGG films derived from Cls XPS spectra.
FIG. 16. Table showing the chemical compositions of 30 pristine GO and reduced and non-reduced side of various FGG films derived from Cls XPS spectra.
FIG. 17. Table showing the fitted results of Cls XPS spectra of reduced, transition, and non-reduced side of FGG films reduced on Zn and Al active metal …
FIG. 18. Table showing the fitted results of Cls XPS spectra of pristine GO film and reduced and non-reduced side of FGG films reduced on various active metal …
FIG. 61. While the GO starts to disintegrate B₂ in water through swelling after approximately 2 minutes, the electrically conductive path is completely …
— | 285.5–289 eV | — |
Temperature | 0–2 °C | — |
Temperature | 40–60 °C | — |
Cited non-patent literature · 4
transient electronic device/flexible circuitry/RFID tag/electrode
nickel
Ni
lead
Pb
copper
Cu
aluminum
Al
zinc
Zn
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 4A. SEM images of reduced side of FGG film developed on Zn substrates.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 12D. Cross-sectional SEM images of FGG films 5 reduced on Ni.
FIG. 14. Table showing the fitted results of Cls XPS spectra of reduced and non-reduced side of FGG films 25 reduced on various active metal substrates.
FIG. 15. Table showing the chemical compositions of reduced and non-reduced side of FGG films derived from Cls XPS spectra.
FIG. 16. Table showing the chemical compositions of 30 pristine GO and reduced and non-reduced side of various FGG films derived from Cls XPS spectra.
FIG. 17. Table showing the fitted results of Cls XPS spectra of reduced, transition, and non-reduced side of FGG films reduced on Zn and Al active metal …
FIG. 18. Table showing the fitted results of Cls XPS spectra of pristine GO film and reduced and non-reduced side of FGG films reduced on various active metal …
FIG. 61. While the GO starts to disintegrate B₂ in water through swelling after approximately 2 minutes, the electrically conductive path is completely …
— | 285.5–289 eV | — |
Temperature | 0–2 °C | — |
Temperature | 40–60 °C | — |
Cited non-patent literature · 4
transient electronic device/flexible circuitry/RFID tag/electrode
nickel
Ni
lead
Pb
copper
Cu
aluminum
Al
zinc
Zn
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 4A. SEM images of reduced side of FGG film developed on Zn substrates.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 12D. Cross-sectional SEM images of FGG films 5 reduced on Ni.
FIG. 14. Table showing the fitted results of Cls XPS spectra of reduced and non-reduced side of FGG films 25 reduced on various active metal substrates.
FIG. 15. Table showing the chemical compositions of reduced and non-reduced side of FGG films derived from Cls XPS spectra.
FIG. 16. Table showing the chemical compositions of 30 pristine GO and reduced and non-reduced side of various FGG films derived from Cls XPS spectra.
FIG. 17. Table showing the fitted results of Cls XPS spectra of reduced, transition, and non-reduced side of FGG films reduced on Zn and Al active metal …
FIG. 18. Table showing the fitted results of Cls XPS spectra of pristine GO film and reduced and non-reduced side of FGG films reduced on various active metal …
FIG. 61. While the GO starts to disintegrate B₂ in water through swelling after approximately 2 minutes, the electrically conductive path is completely …
— | 285.5–289 eV | — |
Temperature | 0–2 °C | — |
Temperature | 40–60 °C | — |
Cited non-patent literature · 4
transient electronic device/flexible circuitry/RFID tag/electrode
nickel
Ni
lead
Pb
copper
Cu
aluminum
Al
zinc
Zn
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 2D. Structural characterization of pristine GO and FGG film reduced on Zn using XPS spectra (non-reduced GO side).
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 3A. Raman spectra of GO, and reduced side of Ni-rGO, Pb-rGO, Cu-rGO, Al-rGO, and Zn-rGO films. 65
FIG. 4A. SEM images of reduced side of FGG film developed on Zn substrates.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 6I. Photographs at different stages of the disintegra- tion process of the U-shaped rGO imprinted on GO films.
FIG. 12D. Cross-sectional SEM images of FGG films 5 reduced on Ni.
FIG. 14. Table showing the fitted results of Cls XPS spectra of reduced and non-reduced side of FGG films 25 reduced on various active metal substrates.
FIG. 15. Table showing the chemical compositions of reduced and non-reduced side of FGG films derived from Cls XPS spectra.
FIG. 16. Table showing the chemical compositions of 30 pristine GO and reduced and non-reduced side of various FGG films derived from Cls XPS spectra.
FIG. 17. Table showing the fitted results of Cls XPS spectra of reduced, transition, and non-reduced side of FGG films reduced on Zn and Al active metal …
FIG. 18. Table showing the fitted results of Cls XPS spectra of pristine GO film and reduced and non-reduced side of FGG films reduced on various active metal …
FIG. 61. While the GO starts to disintegrate B₂ in water through swelling after approximately 2 minutes, the electrically conductive path is completely …
— | 285.5–289 eV | — |
Temperature | 0–2 °C | — |
Temperature | 40–60 °C | — |
Cited non-patent literature · 4