Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Van der Waals heterostructure device with a single-layer MoS₂ channel encapsulated between hBN flakes and contacted with few-layer graphite; device includes Cr/Au edge contacts and a narrow Ti/Au top gate.
ExperimentalMoS₂Studied MaterialhBNSubstrate / DielectricCCapping Or Contact
Cross-section TEM reference sample prepared following the same process as the measured device, used to confirm the thin hBN thickness and single-layer MoS₂ thickness.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Van der Waals heterostructure device with a single-layer MoS₂ channel encapsulated between hBN flakes and contacted with few-layer graphite; device includes Cr/Au edge contacts and a narrow Ti/Au top gate.
ExperimentalMoS₂Studied MaterialhBNSubstrate / DielectricCCapping Or Contact
Cross-section TEM reference sample prepared following the same process as the measured device, used to confirm the thin hBN thickness and single-layer MoS₂ thickness.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Van der Waals heterostructure device with a single-layer MoS₂ channel encapsulated between hBN flakes and contacted with few-layer graphite; device includes Cr/Au edge contacts and a narrow Ti/Au top gate.
ExperimentalMoS₂Studied MaterialhBNSubstrate / DielectricCCapping Or Contact
Cross-section TEM reference sample prepared following the same process as the measured device, used to confirm the thin hBN thickness and single-layer MoS₂ thickness.
Each sample groups how it was prepared, characterized, and measured. Click a card to expand.
Van der Waals heterostructure device with a single-layer MoS₂ channel encapsulated between hBN flakes and contacted with few-layer graphite; device includes Cr/Au edge contacts and a narrow Ti/Au top gate.
ExperimentalMoS₂Studied MaterialhBNSubstrate / DielectricCCapping Or Contact
Cross-section TEM reference sample prepared following the same process as the measured device, used to confirm the thin hBN thickness and single-layer MoS₂ thickness.