Patent
US 8,808,810substrate
graphene-inclusive film
silicon oxide
SiOx
silane-benzophenone derivative SAM
C₉₆
HBC (hexa-peri-hexabenzocoronene)
argon (inert gas)
Ar
acetylene gas
C₂H₂
graphene transparent conductive coating (TCC)
indium tin oxide (ITO)
fluorine-doped tin oxide (FTO, SnO2:F)
SnO2:F
| — |
Pressure | 10–100 mTorr | — |
— | 10–200 ev | — |
— | 20–50 ev | — |
— | 20–40 ev | — |
— | 10–1000 ev | — |
— | 20–500 ev | — |
— | 20–100 ev | — |
Thickness | 340–360 nm | — |
Duration | 15–20 hours | — |
Thickness | ≥ 10 nm | — |
substrate
graphene-inclusive film
silicon oxide
SiOx
silane-benzophenone derivative SAM
C₉₆
HBC (hexa-peri-hexabenzocoronene)
argon (inert gas)
Ar
acetylene gas
C₂H₂
graphene transparent conductive coating (TCC)
indium tin oxide (ITO)
fluorine-doped tin oxide (FTO, SnO2:F)
SnO2:F
| — |
Pressure | 10–100 mTorr | — |
— | 10–200 ev | — |
— | 20–50 ev | — |
— | 20–40 ev | — |
— | 10–1000 ev | — |
— | 20–500 ev | — |
— | 20–100 ev | — |
Thickness | 340–360 nm | — |
Duration | 15–20 hours | — |
Thickness | ≥ 10 nm | — |
substrate
graphene-inclusive film
silicon oxide
SiOx
silane-benzophenone derivative SAM
C₉₆
HBC (hexa-peri-hexabenzocoronene)
argon (inert gas)
Ar
acetylene gas
C₂H₂
graphene transparent conductive coating (TCC)
indium tin oxide (ITO)
fluorine-doped tin oxide (FTO, SnO2:F)
SnO2:F
| — |
Pressure | 10–100 mTorr | — |
— | 10–200 ev | — |
— | 20–50 ev | — |
— | 20–40 ev | — |
— | 10–1000 ev | — |
— | 20–500 ev | — |
— | 20–100 ev | — |
Thickness | 340–360 nm | — |
Duration | 15–20 hours | — |
Thickness | ≥ 10 nm | — |
substrate
graphene-inclusive film
silicon oxide
SiOx
silane-benzophenone derivative SAM
C₉₆
HBC (hexa-peri-hexabenzocoronene)
argon (inert gas)
Ar
acetylene gas
C₂H₂
graphene transparent conductive coating (TCC)
indium tin oxide (ITO)
fluorine-doped tin oxide (FTO, SnO2:F)
SnO2:F
| — |
Pressure | 10–100 mTorr | — |
— | 10–200 ev | — |
— | 20–50 ev | — |
— | 20–40 ev | — |
— | 10–1000 ev | — |
— | 20–500 ev | — |
— | 20–100 ev | — |
Thickness | 340–360 nm | — |
Duration | 15–20 hours | — |
Thickness | ≥ 10 nm | — |