Patent
US 10,546,964gaseous hydrogen selenide
H₂Se
CIGS absorber layer
Cu(In,Ga)Se₂
buffer layer
window layer
silicon dioxide layer
SiO₂
barrier layer
molybdenum oxide film
molybdenum nitride film
Mo-containing layer with oxygen and/or nitrogen
molybdenum oxide
molybdenum nitride
Mo-Se layer thickness (claimed range) | 10–40 | MoSe₂ |
Pressure | 2–10 mTorr | — |
Thickness | 5–100 nm | — |
Thickness | 10–100 nm | — |
Duration | 4–12 hours | — |
Thickness | 5–20 nm | — |
Thickness | 10–40 nm | — |
Thickness | ≥ 1 nm | — |
Duration | 8–12 hours | — |
gaseous hydrogen selenide
H₂Se
CIGS absorber layer
Cu(In,Ga)Se₂
buffer layer
window layer
silicon dioxide layer
SiO₂
barrier layer
molybdenum oxide film
molybdenum nitride film
Mo-containing layer with oxygen and/or nitrogen
molybdenum oxide
molybdenum nitride
Mo-Se layer thickness (claimed range) | 10–40 | MoSe₂ |
Pressure | 2–10 mTorr | — |
Thickness | 5–100 nm | — |
Thickness | 10–100 nm | — |
Duration | 4–12 hours | — |
Thickness | 5–20 nm | — |
Thickness | 10–40 nm | — |
Thickness | ≥ 1 nm | — |
Duration | 8–12 hours | — |
gaseous hydrogen selenide
H₂Se
CIGS absorber layer
Cu(In,Ga)Se₂
buffer layer
window layer
silicon dioxide layer
SiO₂
barrier layer
molybdenum oxide film
molybdenum nitride film
Mo-containing layer with oxygen and/or nitrogen
molybdenum oxide
molybdenum nitride
Mo-Se layer thickness (claimed range) | 10–40 | MoSe₂ |
Pressure | 2–10 mTorr | — |
Thickness | 5–100 nm | — |
Thickness | 10–100 nm | — |
Duration | 4–12 hours | — |
Thickness | 5–20 nm | — |
Thickness | 10–40 nm | — |
Thickness | ≥ 1 nm | — |
Duration | 8–12 hours | — |
gaseous hydrogen selenide
H₂Se
CIGS absorber layer
Cu(In,Ga)Se₂
buffer layer
window layer
silicon dioxide layer
SiO₂
barrier layer
molybdenum oxide film
molybdenum nitride film
Mo-containing layer with oxygen and/or nitrogen
molybdenum oxide
molybdenum nitride
Mo-Se layer thickness (claimed range) | 10–40 | MoSe₂ |
Pressure | 2–10 mTorr | — |
Thickness | 5–100 nm | — |
Thickness | 10–100 nm | — |
Duration | 4–12 hours | — |
Thickness | 5–20 nm | — |
Thickness | 10–40 nm | — |
Thickness | ≥ 1 nm | — |
Duration | 8–12 hours | — |