Patent
US 11,372,300METHOD OF PREPARING GRAPHENE CIRCUIT PATTERN, SUBSTRATE AND ELECTRONIC PRODUCT
Bo HU
US
Copyright © 2026 Matter42. All rights reserved.
Patent
Atlas literature
Patent
US 11,372,300Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1, the m eth o d of preparing a graphene circuit pattern provided by an embodiment comprises step S₁₀₁ to step 5 102. [0 037] Step S 101: immersing a …
FIG. 2D are schematic diagrams of a method of preparing a graphene circuit pattern provided by an embodiment of the present disclosure; [0022 1
FIG. 3 is a flowchart of a method of preparing a graphene circuit pattern provided by another embodiment of the present disclosure; [0023]
FIG. 4 is a flowchart of a method of preparing a graphene circuit pattern provided by still another embodiment of the present disclosure; [0024]
FIG. 5A to F I G. 5 D are schematic diagrams of a method of preparing a graphene circuit pattern provided by still another embodiment of the present …
FIG. 6 is a flowchart of a method of preparing a graphene circuit pattern provided by still another em bod iment of the present disclosure; [0026 1
FIG. 7 is a schematic diagram of a substrate provided by an embodiment of the present disclosure. [0027 1
FIG. 8 is a schematic diagram of a n electronic product provided by an embodiment of the present disclosure.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of preparing a graphene circuit pattern, comprising: immersing a metal circuit pattern in a graphene oxide solution to cause a redox reaction between the metal circuit pattern and q raphene oxide so that the metal circuit pattern is completely consumed, thereby forming the graphene circuit pattern at a location of the metal circuit pattern. Currently amended
The method of preparing a graphene circuit pattern according to claim 1, wherein the metal circuit pattern comprises a circuit pattern formed of a copper containing metallic material, an aluminum containing metallic material or an iron containing metallic material. Original
The method of preparing a graphene circuit pattern according to claim 1, wherein the graphene oxide solution is a dispersion of the graphene oxide in water. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution is (0.01-10) g/L. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a thickness of the metal circuit pattern is 20 nm⁻¹⁰⁰⁰ nm. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: drying the graphene circuit pattern. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: preparing the metal circuit pattern on a substrate, and then immersing the substrate with the metal circuit pattern in the graphene oxide solution. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution and/or a time period of the redox reaction is adjusted to control a thickness of the graphene circuit pattern. Previously presented
(Withdrawn-previously presented) A substrate, comprising the graphene circuit pattern prepared by the method according to claim 1. Withdrawn
1 9. The method of preparing a graphene circuit comprising: preparing the metal circuit pattern on with the metal circuit pattern in the graphene oxide
Materials described outside the worked examples.
metal circuit pattern
graphene oxide solution
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–300 nm | — |
Patent
Atlas literature
Patent
US 11,372,300Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1, the m eth o d of preparing a graphene circuit pattern provided by an embodiment comprises step S₁₀₁ to step 5 102. [0 037] Step S 101: immersing a …
FIG. 2D are schematic diagrams of a method of preparing a graphene circuit pattern provided by an embodiment of the present disclosure; [0022 1
FIG. 3 is a flowchart of a method of preparing a graphene circuit pattern provided by another embodiment of the present disclosure; [0023]
FIG. 4 is a flowchart of a method of preparing a graphene circuit pattern provided by still another embodiment of the present disclosure; [0024]
FIG. 5A to F I G. 5 D are schematic diagrams of a method of preparing a graphene circuit pattern provided by still another embodiment of the present …
FIG. 6 is a flowchart of a method of preparing a graphene circuit pattern provided by still another em bod iment of the present disclosure; [0026 1
FIG. 7 is a schematic diagram of a substrate provided by an embodiment of the present disclosure. [0027 1
FIG. 8 is a schematic diagram of a n electronic product provided by an embodiment of the present disclosure.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of preparing a graphene circuit pattern, comprising: immersing a metal circuit pattern in a graphene oxide solution to cause a redox reaction between the metal circuit pattern and q raphene oxide so that the metal circuit pattern is completely consumed, thereby forming the graphene circuit pattern at a location of the metal circuit pattern. Currently amended
The method of preparing a graphene circuit pattern according to claim 1, wherein the metal circuit pattern comprises a circuit pattern formed of a copper containing metallic material, an aluminum containing metallic material or an iron containing metallic material. Original
The method of preparing a graphene circuit pattern according to claim 1, wherein the graphene oxide solution is a dispersion of the graphene oxide in water. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution is (0.01-10) g/L. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a thickness of the metal circuit pattern is 20 nm⁻¹⁰⁰⁰ nm. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: drying the graphene circuit pattern. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: preparing the metal circuit pattern on a substrate, and then immersing the substrate with the metal circuit pattern in the graphene oxide solution. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution and/or a time period of the redox reaction is adjusted to control a thickness of the graphene circuit pattern. Previously presented
(Withdrawn-previously presented) A substrate, comprising the graphene circuit pattern prepared by the method according to claim 1. Withdrawn
1 9. The method of preparing a graphene circuit comprising: preparing the metal circuit pattern on with the metal circuit pattern in the graphene oxide
Materials described outside the worked examples.
metal circuit pattern
graphene oxide solution
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–300 nm | — |
Patent
Atlas literature
Patent
US 11,372,300Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1, the m eth o d of preparing a graphene circuit pattern provided by an embodiment comprises step S₁₀₁ to step 5 102. [0 037] Step S 101: immersing a …
FIG. 2D are schematic diagrams of a method of preparing a graphene circuit pattern provided by an embodiment of the present disclosure; [0022 1
FIG. 3 is a flowchart of a method of preparing a graphene circuit pattern provided by another embodiment of the present disclosure; [0023]
FIG. 4 is a flowchart of a method of preparing a graphene circuit pattern provided by still another embodiment of the present disclosure; [0024]
FIG. 5A to F I G. 5 D are schematic diagrams of a method of preparing a graphene circuit pattern provided by still another embodiment of the present …
FIG. 6 is a flowchart of a method of preparing a graphene circuit pattern provided by still another em bod iment of the present disclosure; [0026 1
FIG. 7 is a schematic diagram of a substrate provided by an embodiment of the present disclosure. [0027 1
FIG. 8 is a schematic diagram of a n electronic product provided by an embodiment of the present disclosure.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of preparing a graphene circuit pattern, comprising: immersing a metal circuit pattern in a graphene oxide solution to cause a redox reaction between the metal circuit pattern and q raphene oxide so that the metal circuit pattern is completely consumed, thereby forming the graphene circuit pattern at a location of the metal circuit pattern. Currently amended
The method of preparing a graphene circuit pattern according to claim 1, wherein the metal circuit pattern comprises a circuit pattern formed of a copper containing metallic material, an aluminum containing metallic material or an iron containing metallic material. Original
The method of preparing a graphene circuit pattern according to claim 1, wherein the graphene oxide solution is a dispersion of the graphene oxide in water. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution is (0.01-10) g/L. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a thickness of the metal circuit pattern is 20 nm⁻¹⁰⁰⁰ nm. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: drying the graphene circuit pattern. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: preparing the metal circuit pattern on a substrate, and then immersing the substrate with the metal circuit pattern in the graphene oxide solution. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution and/or a time period of the redox reaction is adjusted to control a thickness of the graphene circuit pattern. Previously presented
(Withdrawn-previously presented) A substrate, comprising the graphene circuit pattern prepared by the method according to claim 1. Withdrawn
1 9. The method of preparing a graphene circuit comprising: preparing the metal circuit pattern on with the metal circuit pattern in the graphene oxide
Materials described outside the worked examples.
metal circuit pattern
graphene oxide solution
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–300 nm | — |
Patent
Atlas literature
Patent
US 11,372,300Patent drawings and their descriptions. Click a drawing to enlarge it.
FIG. 1, the m eth o d of preparing a graphene circuit pattern provided by an embodiment comprises step S₁₀₁ to step 5 102. [0 037] Step S 101: immersing a …
FIG. 2D are schematic diagrams of a method of preparing a graphene circuit pattern provided by an embodiment of the present disclosure; [0022 1
FIG. 3 is a flowchart of a method of preparing a graphene circuit pattern provided by another embodiment of the present disclosure; [0023]
FIG. 4 is a flowchart of a method of preparing a graphene circuit pattern provided by still another embodiment of the present disclosure; [0024]
FIG. 5A to F I G. 5 D are schematic diagrams of a method of preparing a graphene circuit pattern provided by still another embodiment of the present …
FIG. 6 is a flowchart of a method of preparing a graphene circuit pattern provided by still another em bod iment of the present disclosure; [0026 1
FIG. 7 is a schematic diagram of a substrate provided by an embodiment of the present disclosure. [0027 1
FIG. 8 is a schematic diagram of a n electronic product provided by an embodiment of the present disclosure.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of preparing a graphene circuit pattern, comprising: immersing a metal circuit pattern in a graphene oxide solution to cause a redox reaction between the metal circuit pattern and q raphene oxide so that the metal circuit pattern is completely consumed, thereby forming the graphene circuit pattern at a location of the metal circuit pattern. Currently amended
The method of preparing a graphene circuit pattern according to claim 1, wherein the metal circuit pattern comprises a circuit pattern formed of a copper containing metallic material, an aluminum containing metallic material or an iron containing metallic material. Original
The method of preparing a graphene circuit pattern according to claim 1, wherein the graphene oxide solution is a dispersion of the graphene oxide in water. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution is (0.01-10) g/L. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a thickness of the metal circuit pattern is 20 nm⁻¹⁰⁰⁰ nm. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: drying the graphene circuit pattern. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, further comprising: preparing the metal circuit pattern on a substrate, and then immersing the substrate with the metal circuit pattern in the graphene oxide solution. Previously presented
The method of preparing a graphene circuit pattern according to claim 1, wherein a concentration of the graphene oxide solution and/or a time period of the redox reaction is adjusted to control a thickness of the graphene circuit pattern. Previously presented
(Withdrawn-previously presented) A substrate, comprising the graphene circuit pattern prepared by the method according to claim 1. Withdrawn
1 9. The method of preparing a graphene circuit comprising: preparing the metal circuit pattern on with the metal circuit pattern in the graphene oxide
Materials described outside the worked examples.
metal circuit pattern
graphene oxide solution
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
Thickness | 40–300 nm | — |
copper containing metallic material
aluminum containing metallic material
iron containing metallic material
graphene circuit pattern
graphene oxide dispersed in deionized water
copper containing metallic material
aluminum containing metallic material
iron containing metallic material
graphene circuit pattern
graphene oxide dispersed in deionized water
copper containing metallic material
aluminum containing metallic material
iron containing metallic material
graphene circuit pattern
graphene oxide dispersed in deionized water
copper containing metallic material
aluminum containing metallic material
iron containing metallic material
graphene circuit pattern
graphene oxide dispersed in deionized water