Patent
US 9,933,121METHOD OF MAKING LED LIGHT BULB WITH GRAPHENE FILAMENT
Chung-Ping LAI
US
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Patent
Atlas literature
Patent
US 9,933,121Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 and 2 show graphene laminate film is deposited on a polyethylene terephthalate (PET) substrate, and a thermal conductivity of the graphene laminate film …
FIGS. 3 to 9 show a LED light bulb with the Graphene filament according to a preferred embodiment of the present invention is made.
FIG. 11 shows a huge dissipation path in which graphene coating illustrated obvious heat spreading effect. The terminal temperature with and without graphene …
FIG. 12 shows, the LED light bulb with the Graphene filament is tested according to the preferred embodiment of the present invention.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of making a LED light bulb with the Graphene filament according to a preferred embodiment comprises steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate, wherein the graphene-based heat dissipation ink is dried so as to form a graphene-based radiation film forms on the back side of the flexible substrate; C. cu tt ing the printed circuit board (PCB) on which-a the g raphene-based radiation film is coated to form plural Graphene filaments; and D. fixing the plural Graphene filaments into a light bulb. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink consists of graphene, heat dissipation fillers, dispersants and binders, such that the graphene-based heat dissipation ink takes both lateral heat spreading ability and heat radiation ability to dissipate heat. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based radiation film is coated by any one of spray coating, brushing, screen printing, or nozzle printing via the graphene-based heat dissipation ink. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the Graphene filaments are fixed in a bended or arched position. Original
The method of making the LED light bulb as claimed in claim 1, wherein the heat dissipation fillers are at least one of carbon materials, metal particles and far infrared-ray radiation powders. Original
Layer stacks claimed or described, ordered top of device to substrate.
LED light bulb with Graphene filament
Materials described outside the worked examples.
graphene
graphene-based heat dissipation ink
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of graphene laminate film on PET substrate | 40–90 W/mK | graphene laminate film on PET substrate |
temperature difference demonstrating heat radiation ability of graphene-based heat dissipation film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,933,121Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 and 2 show graphene laminate film is deposited on a polyethylene terephthalate (PET) substrate, and a thermal conductivity of the graphene laminate film …
FIGS. 3 to 9 show a LED light bulb with the Graphene filament according to a preferred embodiment of the present invention is made.
FIG. 11 shows a huge dissipation path in which graphene coating illustrated obvious heat spreading effect. The terminal temperature with and without graphene …
FIG. 12 shows, the LED light bulb with the Graphene filament is tested according to the preferred embodiment of the present invention.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of making a LED light bulb with the Graphene filament according to a preferred embodiment comprises steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate, wherein the graphene-based heat dissipation ink is dried so as to form a graphene-based radiation film forms on the back side of the flexible substrate; C. cu tt ing the printed circuit board (PCB) on which-a the g raphene-based radiation film is coated to form plural Graphene filaments; and D. fixing the plural Graphene filaments into a light bulb. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink consists of graphene, heat dissipation fillers, dispersants and binders, such that the graphene-based heat dissipation ink takes both lateral heat spreading ability and heat radiation ability to dissipate heat. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based radiation film is coated by any one of spray coating, brushing, screen printing, or nozzle printing via the graphene-based heat dissipation ink. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the Graphene filaments are fixed in a bended or arched position. Original
The method of making the LED light bulb as claimed in claim 1, wherein the heat dissipation fillers are at least one of carbon materials, metal particles and far infrared-ray radiation powders. Original
Layer stacks claimed or described, ordered top of device to substrate.
LED light bulb with Graphene filament
Materials described outside the worked examples.
graphene
graphene-based heat dissipation ink
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of graphene laminate film on PET substrate | 40–90 W/mK | graphene laminate film on PET substrate |
temperature difference demonstrating heat radiation ability of graphene-based heat dissipation film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,933,121Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 and 2 show graphene laminate film is deposited on a polyethylene terephthalate (PET) substrate, and a thermal conductivity of the graphene laminate film …
FIGS. 3 to 9 show a LED light bulb with the Graphene filament according to a preferred embodiment of the present invention is made.
FIG. 11 shows a huge dissipation path in which graphene coating illustrated obvious heat spreading effect. The terminal temperature with and without graphene …
FIG. 12 shows, the LED light bulb with the Graphene filament is tested according to the preferred embodiment of the present invention.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of making a LED light bulb with the Graphene filament according to a preferred embodiment comprises steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate, wherein the graphene-based heat dissipation ink is dried so as to form a graphene-based radiation film forms on the back side of the flexible substrate; C. cu tt ing the printed circuit board (PCB) on which-a the g raphene-based radiation film is coated to form plural Graphene filaments; and D. fixing the plural Graphene filaments into a light bulb. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink consists of graphene, heat dissipation fillers, dispersants and binders, such that the graphene-based heat dissipation ink takes both lateral heat spreading ability and heat radiation ability to dissipate heat. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based radiation film is coated by any one of spray coating, brushing, screen printing, or nozzle printing via the graphene-based heat dissipation ink. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the Graphene filaments are fixed in a bended or arched position. Original
The method of making the LED light bulb as claimed in claim 1, wherein the heat dissipation fillers are at least one of carbon materials, metal particles and far infrared-ray radiation powders. Original
Layer stacks claimed or described, ordered top of device to substrate.
LED light bulb with Graphene filament
Materials described outside the worked examples.
graphene
graphene-based heat dissipation ink
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of graphene laminate film on PET substrate | 40–90 W/mK | graphene laminate film on PET substrate |
temperature difference demonstrating heat radiation ability of graphene-based heat dissipation film |
Related documents with shared materials, methods, properties, or citations.
Patent
Atlas literature
Patent
US 9,933,121Patent drawings and their descriptions. Click a drawing to enlarge it.
FIGS. 1 and 2 show graphene laminate film is deposited on a polyethylene terephthalate (PET) substrate, and a thermal conductivity of the graphene laminate film …
FIGS. 3 to 9 show a LED light bulb with the Graphene filament according to a preferred embodiment of the present invention is made.
FIG. 11 shows a huge dissipation path in which graphene coating illustrated obvious heat spreading effect. The terminal temperature with and without graphene …
FIG. 12 shows, the LED light bulb with the Graphene filament is tested according to the preferred embodiment of the present invention.
Claims define the patent's legal scope. Independent claims stand alone; dependent claims (nested) narrow them. Click a claim to expand its dependents.
A method of making a LED light bulb with the Graphene filament according to a preferred embodiment comprises steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate, wherein the graphene-based heat dissipation ink is dried so as to form a graphene-based radiation film forms on the back side of the flexible substrate; C. cu tt ing the printed circuit board (PCB) on which-a the g raphene-based radiation film is coated to form plural Graphene filaments; and D. fixing the plural Graphene filaments into a light bulb. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based heat dissipation ink consists of graphene, heat dissipation fillers, dispersants and binders, such that the graphene-based heat dissipation ink takes both lateral heat spreading ability and heat radiation ability to dissipate heat. Original
The method of making the LED light bulb as claimed in claim 1, wherein the graphene-based radiation film is coated by any one of spray coating, brushing, screen printing, or nozzle printing via the graphene-based heat dissipation ink. Currently amended
The method of making the LED light bulb as claimed in claim 1, wherein the Graphene filaments are fixed in a bended or arched position. Original
The method of making the LED light bulb as claimed in claim 1, wherein the heat dissipation fillers are at least one of carbon materials, metal particles and far infrared-ray radiation powders. Original
Layer stacks claimed or described, ordered top of device to substrate.
LED light bulb with Graphene filament
Materials described outside the worked examples.
graphene
graphene-based heat dissipation ink
Additional fabrication and treatment steps described in the patent.
Performance values and ranges asserted in the specification or claims.
| Property | Value | Material |
|---|---|---|
thermal conductivity of graphene laminate film on PET substrate | 40–90 W/mK | graphene laminate film on PET substrate |
temperature difference demonstrating heat radiation ability of graphene-based heat dissipation film |
Related documents with shared materials, methods, properties, or citations.
flexible PCB substrate
copper lines
Cu
carbon materials (heat dissipation fillers)
metal particles (heat dissipation fillers)
far infrared-ray radiation powders
carbon black
graphite
carbon nanotubes
activated carbon
graphene laminate film on PET substrate
polyethylene terephthalate (PET)
graphene-based heat dissipation ink |
— | 40–90 W | — |
flexible PCB substrate
copper lines
Cu
carbon materials (heat dissipation fillers)
metal particles (heat dissipation fillers)
far infrared-ray radiation powders
carbon black
graphite
carbon nanotubes
activated carbon
graphene laminate film on PET substrate
polyethylene terephthalate (PET)
graphene-based heat dissipation ink |
— | 40–90 W | — |
flexible PCB substrate
copper lines
Cu
carbon materials (heat dissipation fillers)
metal particles (heat dissipation fillers)
far infrared-ray radiation powders
carbon black
graphite
carbon nanotubes
activated carbon
graphene laminate film on PET substrate
polyethylene terephthalate (PET)
graphene-based heat dissipation ink |
— | 40–90 W | — |
flexible PCB substrate
copper lines
Cu
carbon materials (heat dissipation fillers)
metal particles (heat dissipation fillers)
far infrared-ray radiation powders
carbon black
graphite
carbon nanotubes
activated carbon
graphene laminate film on PET substrate
polyethylene terephthalate (PET)
graphene-based heat dissipation ink |
— | 40–90 W | — |