Patent
US 10,285,218tin layer
Sn
silicon layer
Si
silicon dioxide layer
SiO₂
HNO₃ solution
HNO₃
argon gas
Ar
inert gas
Cr/Au metal lines
Ti/Ir metal lines
Ti/W metal lines
Si₃N₄ passivation layer
Si₃N₄
| ≥ 250 °C |
| — |
Thickness | 1–200 nm | — |
Pressure | ≤ 1 atm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 50 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 30 nm | — |
Thickness | ≤ 25 nm | — |
Thickness | ≤ 10 nm | — |
tin layer
Sn
silicon layer
Si
silicon dioxide layer
SiO₂
HNO₃ solution
HNO₃
argon gas
Ar
inert gas
Cr/Au metal lines
Ti/Ir metal lines
Ti/W metal lines
Si₃N₄ passivation layer
Si₃N₄
| ≥ 250 °C |
| — |
Thickness | 1–200 nm | — |
Pressure | ≤ 1 atm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 50 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 30 nm | — |
Thickness | ≤ 25 nm | — |
Thickness | ≤ 10 nm | — |
tin layer
Sn
silicon layer
Si
silicon dioxide layer
SiO₂
HNO₃ solution
HNO₃
argon gas
Ar
inert gas
Cr/Au metal lines
Ti/Ir metal lines
Ti/W metal lines
Si₃N₄ passivation layer
Si₃N₄
| ≥ 250 °C |
| — |
Thickness | 1–200 nm | — |
Pressure | ≤ 1 atm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 50 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 30 nm | — |
Thickness | ≤ 25 nm | — |
Thickness | ≤ 10 nm | — |
tin layer
Sn
silicon layer
Si
silicon dioxide layer
SiO₂
HNO₃ solution
HNO₃
argon gas
Ar
inert gas
Cr/Au metal lines
Ti/Ir metal lines
Ti/W metal lines
Si₃N₄ passivation layer
Si₃N₄
| ≥ 250 °C |
| — |
Thickness | 1–200 nm | — |
Pressure | ≤ 1 atm | — |
Thickness | ≤ 1 nm | — |
Thickness | ≤ 50 nm | — |
Thickness | ≤ 40 nm | — |
Thickness | ≤ 30 nm | — |
Thickness | ≤ 25 nm | — |
Thickness | ≤ 10 nm | — |