Patent
US 10,091,916silicon carbon nitride
SiCN
ethanol suspension (PS₄ binder)
ceramic matrix composite (CMC) material
| 0.42 g/cm3 |
carbon nanotubes |
graphene partial density in composite (claimed) | 0.42 g/cm3 | graphene |
SiCN partial density in composite (claimed) | 1.26 g/cm3 | SiCN |
CMC composite electrical conductivity (embodiment) | ≥ 3000000 S/m | ceramic matrix composite (CMC) material |
CMC composite density (embodiment, summary) | 2 g/cm3 | ceramic matrix composite (CMC) material |
Thickness | 1–50 nm | — |
Thickness | 0.1–1 µm | — |
Pressure | 297–376 psi | — |
Thickness | 0.5–4 mm | — |
Duration | 1–16 hours | — |
Duration | 3–8 hours | — |
Thickness | 6–8 nm | — |
Thickness | 5–25 µm | — |
Duration | 1–13 hours | — |
Thickness | ≤ 1 nm | — |
silicon carbon nitride
SiCN
ethanol suspension (PS₄ binder)
ceramic matrix composite (CMC) material
| 0.42 g/cm3 |
carbon nanotubes |
graphene partial density in composite (claimed) | 0.42 g/cm3 | graphene |
SiCN partial density in composite (claimed) | 1.26 g/cm3 | SiCN |
CMC composite electrical conductivity (embodiment) | ≥ 3000000 S/m | ceramic matrix composite (CMC) material |
CMC composite density (embodiment, summary) | 2 g/cm3 | ceramic matrix composite (CMC) material |
Thickness | 1–50 nm | — |
Thickness | 0.1–1 µm | — |
Pressure | 297–376 psi | — |
Thickness | 0.5–4 mm | — |
Duration | 1–16 hours | — |
Duration | 3–8 hours | — |
Thickness | 6–8 nm | — |
Thickness | 5–25 µm | — |
Duration | 1–13 hours | — |
Thickness | ≤ 1 nm | — |
silicon carbon nitride
SiCN
ethanol suspension (PS₄ binder)
ceramic matrix composite (CMC) material
| 0.42 g/cm3 |
carbon nanotubes |
graphene partial density in composite (claimed) | 0.42 g/cm3 | graphene |
SiCN partial density in composite (claimed) | 1.26 g/cm3 | SiCN |
CMC composite electrical conductivity (embodiment) | ≥ 3000000 S/m | ceramic matrix composite (CMC) material |
CMC composite density (embodiment, summary) | 2 g/cm3 | ceramic matrix composite (CMC) material |
Thickness | 1–50 nm | — |
Thickness | 0.1–1 µm | — |
Pressure | 297–376 psi | — |
Thickness | 0.5–4 mm | — |
Duration | 1–16 hours | — |
Duration | 3–8 hours | — |
Thickness | 6–8 nm | — |
Thickness | 5–25 µm | — |
Duration | 1–13 hours | — |
Thickness | ≤ 1 nm | — |
silicon carbon nitride
SiCN
ethanol suspension (PS₄ binder)
ceramic matrix composite (CMC) material
| 0.42 g/cm3 |
carbon nanotubes |
graphene partial density in composite (claimed) | 0.42 g/cm3 | graphene |
SiCN partial density in composite (claimed) | 1.26 g/cm3 | SiCN |
CMC composite electrical conductivity (embodiment) | ≥ 3000000 S/m | ceramic matrix composite (CMC) material |
CMC composite density (embodiment, summary) | 2 g/cm3 | ceramic matrix composite (CMC) material |
Thickness | 1–50 nm | — |
Thickness | 0.1–1 µm | — |
Pressure | 297–376 psi | — |
Thickness | 0.5–4 mm | — |
Duration | 1–16 hours | — |
Duration | 3–8 hours | — |
Thickness | 6–8 nm | — |
Thickness | 5–25 µm | — |
Duration | 1–13 hours | — |
Thickness | ≤ 1 nm | — |